The problem are in bold, causes are below the problems and
recommended action is on the right hand side
1. Thick coating
Voltage too high Reduce voltage
Temperature too high Operate at below 30━C
Coating time too long Reduce coating time
2. Orange peel
Solvent level too high Purge with ultrafiltration
High surge current Reduce voltage
3. Thin deposit
Voltage too low Increase voltage
Solvent too low Adjust solvent level upwards
Coating time too short Increase coating time
4.Thin film with high density pitting
Solvent too low Analyze & adjust solvent level
Temperature too low Operate above 23━C
5. Iridescent deposit
Deposit too thin Increase voltage and/or coating time
Temperature too low Operate above 23━C
6. Thin patchy deposit
Solvent too low Analyze & adjust solvent level
Solids too low Analyze & adjust solid level
7.Rough, spotty, scattered pits
Ionic contamination Strip lacquer coating & check substrate condition. Purge with UF unit
Dirty, dusty oven Clean oven thoroughly
Insoluble particles Filter bath
Poor quality rinse water Use de-ionised water with a conductivity of less than 5 レS
8.Water breaks during post rinsing
Solvent too high Purge with UF unit
9.Water marks after curing
Incorrect or insufficient post-rinsing Use 1 - 2 mls / litre of Rinse Additive
10.Gas pits/ Voids
Too much aeration in the solution Switch off pumps and allow solution to clear
Correct pump problem and use gentle agitation;
Minimize aeration and foaming action
Incomplete wetting of parts surface Refer to pre-rinsing procedure prior to plating
11.Soft deposit- Poor chemical resistance
Low curing temperature Cure at metal temperature of 140 to 160━C for up to 20 to 30 minutes
Insufficient curing time Increase curing time
12. Darker/ discoloration
Curing temperature too high Decrease curing temperature
13. Low gloss/ hazy deposit
Deposit too thick Reduce voltage
Solvent too low Analyze & adjust solvent level
Contamination Purge with UF unit
14. Poor throwing power
Incorrect anode to cathode ratio Use 1:1 and 1:2 ratio
Anode length shorter than cathode Use anode that is at least of the same length as the cathode for better distribution
15. Low conductivity (less than 450 レS
Low solids Analyze & adjust solids
Low solvents Analyze & adjust solvents
16. High conductivity (greater than 800 レS
High solids Reduce voltage
High solvents Purge with Ultrafiltration
Ionic contamination Purge with ultrafiltration
For more information write to us on
info@shinextechnologies.co.uk
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